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NTMFS4834N
Power MOSFET
30 V, 130 A, Single N ? Channel, SO ? 8FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These are Pb ? Free Devices
http://onsemi.com
Applications
? Refer to Application Note AND8195/D
? CPU Power Delivery
? DC ? DC Converters
? Low Side Switching
V (BR)DSS
30 V
R DS(ON) MAX
3.0 m W @ 10 V
4.0 m W @ 4.5 V
D (5,6)
I D MAX
130 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
V DSS
30
V
G (4)
Gate ? to ? Source Voltage
Continuous Drain
Current R q JA
(Note 1)
Power Dissipation
R q JA (Note 1)
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
V GS
I D
P D
± 20
21
15
2.31
V
A
W
S (1,2,3)
N ? CHANNEL MOSFET
MARKING
S
AYWZZ
S
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC
(Note 1)
Power Dissipation
R q JC (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
T C = 25 ° C
ID
P D
I D
P D
13
9.5
0.9
130
93
86.2
A
W
A
W
SO ? 8 FLAT LEAD
CASE 488AA
A = Assembly Location
Y = Year
W = Work Week
1 S
STYLE 1 G
DIAGRAM
D
4834N
D
D
D
Pulsed Drain
Current
T A = 25 ° C,
t p = 10 m s
I DM
260
A
ZZ
= Lot Traceability
Operating Junction and Storage
Temperature
T J , T STG
? 55 to
+150
° C
Source Current (Body Diode)
I S
71
A
ORDERING INFORMATION
Drain to Source DV/DT
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 32 A pk , L = 1.0 mH, R G = 25 W)
dV/dt
EAS
6
512
V/ns
mJ
Device
NTMFS4834NT1G
Package
SO ? 8FL
(Pb ? Free)
Shipping ?
1500 Tape / Reel
Lead Temperature for Soldering Purposes T L 260 ° C
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
NTMFS4834NT3G SO ? 8FL 5000 Tape / Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 6
1
Publication Order Number:
NTMFS4834N/D
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